| 摘要 |
A retainer ring capable of effectively minimizing a time required for breaking-in polishing. In a CMP device (1) polishing a wafer (W) in chemical machinery manner, the retainer ring (8) disposed in a holding head (4), formed in a ring shape, surrounding the outer periphery of the wafer (W), and pressing the polishing surface (3a) of a polishing pad (3) is formed of an engineering plastic material such as a PPS. The surface roughness of the pressing surface (8a) of the retainer ring pressing the polishing surface (3a) of the polishing pad (3) is set to 0.01 mum or less in centerline average height (Ra).
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