Serpentine, slit fin heat sink device

摘要

A serpentine, slit fin (26) is provided for a heat sink device (10) used for cooling a electronic component (12) having a surface (14) that rejects heat. The heat sink (10) includes a plate (16) having first and second surfaces (18, 20), with the first surface (18) configured to receive heat from the surface (14) of the electronic component (12). The fin (26) is bonded to the second surface and includes a plurality of offset sidewall portions (48). In one form, a fan (22) is spaced above the second surface (20) to direct an impingement airflow (24) towards the second surface (20) substantially perpendicular to the second surface (20), and the serpentine, slit fin (26) underlies the fan (22) and is bonded to the second surface (20).