发明名称 Thermosetting resin composition containing malemide and/or vinyl compounds
摘要 The invention provides a thermosetting resin composition comprising: (a) a maleimide having the structure: <CHEM> wherein: m = 1, 2 or 3, (b) in the range of about 0.01 up to about 10 equivalents of a vinyl compound per equivalent of maleimide, wherein said vinyl compound has the structure: <CHEM> wherein: q is 1, 2 or 3, and each Q is independently selected from -O-, -O-C(O)-, -C(O)- or -C(O)-O-, (c) in the range of 0.2 up to 3 wt % of at least one free radical initiator, based on the total weight of the composition.
申请公布号 EP1344789(A2) 申请公布日期 2003.09.17
申请号 EP20030013033 申请日期 1995.08.30
申请人 HENKEL CORPORATION 发明人 DERSHEM, STEPHEN M.;PATTERSON, DENNIS B.;OSUNA, JOSE A.
分类号 C07D207/44;C07D207/452;C07D401/04;C08F22/40;C08F290/06;C08G65/32;C08G73/10;C08G73/12;C08G77/04;C09J4/00;C09J179/08;H01L21/52;(IPC1-7):C08G73/10 主分类号 C07D207/44
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