INTEGRAL-TYPE CERAMIC CIRCUIT BOARD AND METHOD OF PRODUCING SAME

摘要

A substrate for mounting an electronic component, comprising a baseplate having a main surface formed with or without a recess; a ceramic substrate provided on the main surface of the baseplate and having a smaller size than the baseplate; and a metal layer provided so as to cover both of the baseplate and the ceramic substrate; wherein the metal layer has a surface remote from the baseplate and the ceramic substrate made flat, the baseplate is made of a metal-ceramic composite of a metallic material and a ceramic material, and the metallic material in the composite and the metal layer have different compositions. There is provided an integral ceramic circuit board, which is resistant to repeated thermal stress and is superior in reliability.