| 摘要 |
The present invention relates to the integration of micro-optical elements (16) on a semiconductor substrate (2), particularly elements such as glass-material optical components such as lenses (16), beam splitters, mirrors and polarising elements. A micro-optical device (100), comprises a silicon substrate (2), and at least one glass-material micro-optical element (16) mounted on said substrate (2). The device (100) also includes a glass-material stand (30), for example a glass frit, interposed between the micro-optical element (16) and substrate (2). The stand (30) is fuse-bonded to both the substrate (2) and the micro-optical element (16). The substrate (2) has within a groove (13) a recess bounded by one or more walls, and the stand (30) is dimensioned to fit within the recess and be positioned by one or more walls of the recess. <IMAGE> |
