发明名称 HEAT ACCUMULATION TYPE FIBERBOARD AND UTILIZATION METHOD THEREFOR
摘要 <P>PROBLEM TO BE SOLVED: To provide a fiberboard having heat accumulation properties utilizable as a building interior material arranged so as to be pasted on the indoor side surfaces such as the wall, ceiling, floor or the like of a house to keep a comfortable room temperature for a long time even if heat preliminarily accumulated by a cooling and heating instrument or natural energy is gradually radiated to generate a large change in the open air temperature. <P>SOLUTION: This heat accumulating fiberboard is obtained by the thermal pressure bonding molding of a composition comprising microcapsules including a heat accumulating material, woody fibers and an adhesive. The film of the microcapsules preferably comprises a thermosetting urea/formalin resin or a melamine/formalin resin and the volume mean particle size thereof is preferably 10 &mu;m or less. The heat accumulation material preferably has a melting point of 5-50&deg;C and can be utilized as a building interior material for stabilizing a room temperature. <P>COPYRIGHT: (C)2003,JPO
申请公布号 JP2003260705(A) 申请公布日期 2003.09.16
申请号 JP20020061834 申请日期 2002.03.07
申请人 MITSUBISHI PAPER MILLS LTD 发明人 ISHIGURO MAMORU
分类号 B27N3/04;C09K5/08;E04B1/74;E04B1/80;E04C2/16;F28D20/00 主分类号 B27N3/04
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