发明名称 METHOD AND DEVICE FOR GRINDING THERMAL HEAD
摘要 PROBLEM TO BE SOLVED: To grind to remove a step on a surface of a protection layer of a thermal head. SOLUTION: In this thermal head 10 having a partial glaze layer 13A, a step due to a thickness of an electrode is formed on the surface of the protection layer covering a heating element array. A platen roller 1 is provided such that the shaft thereof can be moved by a piezoelectric actuator. The platen roller 1 presses a lapping sheet 8 against the surface of the protection layer. The platen roller 1 moves in a direction parallel to a conveyance direction of the lapping sheet 8 and the step is ground to be removed. The moving speed of the platen roller 1 is lowered at a portion where the amount in grinding is large and the moving speed thereof is raised at a portion where the amount in grinding is small. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003260808(A) 申请公布日期 2003.09.16
申请号 JP20020065219 申请日期 2002.03.11
申请人 FUJI PHOTO FILM CO LTD 发明人 NISHIMURA TOMOYOSHI
分类号 B41J2/335;(IPC1-7):B41J2/335 主分类号 B41J2/335
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