发明名称 |
Semiconductor device and mounting board |
摘要 |
A semiconductor device in which a semiconductor chip 1 is bonded by a metal bond 2 to one surface of a heat sink 4 formed of a material with a thermal expansion coefficient is close to he semiconductor chip 1, the heat sink 4 is glued to a stiffener with a silicon adhesive 5 with an elastic modulus of 10 MPa or less, a TAB tape 9 is glued to the stiffener 3 with an epoxy adhesive 6, and the semiconductor chip 1 is sealed with an epoxy sealing resin 8 with an elastic modulus of 10 GPa or more for protection from outside.
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申请公布号 |
US6621160(B2) |
申请公布日期 |
2003.09.16 |
申请号 |
US20020046258 |
申请日期 |
2002.01.16 |
申请人 |
HITACHI, LTD. |
发明人 |
SHIBAMOTO MASANORI;ICHITANI MASAHIRO;HARUTA RYO;MATSUMOTO KATSUYUKI;ARITA JUNICHI;ANJO ICHIRO |
分类号 |
H01L23/13;H01L23/16;H01L23/24;H01L23/29;H01L23/31;H01L23/34;H01L23/36;H01L23/367;H01L23/373;H01L23/495;H01L23/498;(IPC1-7):H01L23/34 |
主分类号 |
H01L23/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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