| 摘要 |
During the development of process parameters for fabricating an integrated circuit, a test circuit is provided on the wafer that provides rapid identification of process problems. Open circuits are identified by sequentially connecting one end of the conductive paths to the signal source and measuring the current at the other end. Short circuits are identified by sequentially connecting first conductive paths to the signal source and measuring the current generated in the second conductive paths. The location of breaks in the first conductive paths is identified by systematically bypassing sections of the first conductive paths, thereby facilitating failure analysis.
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