发明名称 Heat exchanger for an electronic heat pump
摘要 A heat exchanger 17 for an electronic heat pump 11 includes a thermally conductive base plate 18 having first and second surfaces, the first surface being flat and adapted to make intimate surface contact with a surface of the electronic heat pump and the second surface being obverse to the first surface and supporting an array of thermally conductive fins 21. The adjacent fins 21 define there between a plurality of micro channels.
申请公布号 US6619044(B2) 申请公布日期 2003.09.16
申请号 US20020206731 申请日期 2002.07.26
申请人 HYDROCOOL PYT, LIMITED 发明人 BATCHELOR ANDREW W.;BANNEY BEN;MCDONALD DAVID;CHANDRATILLEKE TILAK T.
分类号 F28F1/04;F28F3/02;F28F3/12;(IPC1-7):F25B21/02 主分类号 F28F1/04
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