发明名称 Multilayer integrated substrate and manufacturing method for multilayer ceramic element
摘要 A multilayer integrated substrate includes breaking grooves arranged in a grid pattern so as to section the main surface of the substrate into a plurality of blocks, and also includes fracture-preventing conductor films arranged so as to cross the breaking grooves. The fracture-preventing conductor films contain a metal component that prevents undesirable fracturing of the multilayer integrated substrate along the breaking grooves.
申请公布号 US6621010(B2) 申请公布日期 2003.09.16
申请号 US20010783922 申请日期 2001.02.15
申请人 MURATA MANUFACTURING CO., LTD. 发明人 SAKAI NORIO;IIDA KAZUHIRO
分类号 H01G4/12;H01G4/30;H01L21/48;H01L23/58;H05K1/02;H05K1/03;H05K3/00;H05K3/46;(IPC1-7):H05K1/03 主分类号 H01G4/12
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