发明名称 Method of forming a contact structure and a container capacitor structure
摘要 Method for forming at least a portion of a top electrode of a container capacitor and at least a portion of a contact plug in one deposition are described. In one embodiment, the top electrode is formed interior to a bottom electrode of the container capacitor. In another embodiment, the top electrode is formed interior to, and exterior and below a portion of the bottom electrode of the container capacitor. The method of forming a top electrode of a container capacitor and a contact plug with a same deposition is particularly well-suited for high-density memory array formation.
申请公布号 US6620680(B2) 申请公布日期 2003.09.16
申请号 US20020080465 申请日期 2002.02.22
申请人 MICRON TECHNOLOGY, INC. 发明人 DURCAN D. MARK;DOAN TRUNG T.;LEE ROGER R.;GONZALEZ FERNANDO
分类号 H01L21/02;H01L21/8242;H01L27/108;(IPC1-7):H01L21/824;H01L21/20 主分类号 H01L21/02
代理机构 代理人
主权项
地址