发明名称 |
MOLD RELEASE POLYESTER FILM FOR HOT PRESS MOLDING |
摘要 |
PROBLEM TO BE SOLVED: To provide a mold release polyester film for hot press molding suitable as a film for processing, capable of reducing the stainability of a circuit portion and the surface of a circuit during hot press molding, especially during production of the flexible printed circuit board (FPC) and capable of providing mold releasability. SOLUTION: The mold release polyester film for hot press molding is characterized by being obtaining by coating a coating liquid containing a fluorine-containing resin, a block isocyanate crosslinking agent containing polyalkylene glycol chains as essential components onto a polyester film. COPYRIGHT: (C)2008,JPO&INPIT |
申请公布号 |
JP2008162222(A) |
申请公布日期 |
2008.07.17 |
申请号 |
JP20060356965 |
申请日期 |
2006.12.31 |
申请人 |
MITSUBISHI PLASTICS IND LTD |
发明人 |
MACHIDA KENZO;FUJITA MASATO |
分类号 |
B32B27/36;B32B3/00;B32B27/00 |
主分类号 |
B32B27/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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