发明名称 MOLD RELEASE POLYESTER FILM FOR HOT PRESS MOLDING
摘要 PROBLEM TO BE SOLVED: To provide a mold release polyester film for hot press molding suitable as a film for processing, capable of reducing the stainability of a circuit portion and the surface of a circuit during hot press molding, especially during production of the flexible printed circuit board (FPC) and capable of providing mold releasability. SOLUTION: The mold release polyester film for hot press molding is characterized by being obtaining by coating a coating liquid containing a fluorine-containing resin, a block isocyanate crosslinking agent containing polyalkylene glycol chains as essential components onto a polyester film. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008162222(A) 申请公布日期 2008.07.17
申请号 JP20060356965 申请日期 2006.12.31
申请人 MITSUBISHI PLASTICS IND LTD 发明人 MACHIDA KENZO;FUJITA MASATO
分类号 B32B27/36;B32B3/00;B32B27/00 主分类号 B32B27/36
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