发明名称 Interconnected circuit board assembly and system
摘要 An electrical assembly (200, FIG. 2) is formed from two, interconnected circuit boards (202, 204). Conductive spacers (240) and a conductive material (260) are placed between complementary bond pads (218, 232) on the circuit boards. The conductive spacers are formed from a material that maintains its mechanical integrity during the process of attaching the circuit boards. The conductive material is a solder or conductive adhesive used to mechanically attach the circuit boards. In addition, an insulating material (270) is inserted into an interface region (250) between the circuit boards. The insulating material provides additional mechanical connection between the circuit boards. In one embodiment, one circuit board (202) includes a glass panel that holds an array of organic light emitting diodes (OLEDs), and the other circuit board (204) is a ceramic circuit board. Together, the interconnected circuit board assembly (200) forms a portion of a flat panel display (1102, FIG. 11).
申请公布号 US6621168(B2) 申请公布日期 2003.09.16
申请号 US20000750444 申请日期 2000.12.28
申请人 INTEL CORPORATION 发明人 SUNDAHL ROBERT C.;WONG KENNETH
分类号 H01L27/32;H05K1/03;H05K3/28;H05K3/32;H05K3/40;H05K3/46;(IPC1-7):H01L23/48 主分类号 H01L27/32
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