| 摘要 |
<P>PROBLEM TO BE SOLVED: To attain low equipment cost, short manufacturing time, and labor saving by performing smooth polishing in two stages of double-surface rough- polishing and single-surface finish polishing with a relatively simple device. <P>SOLUTION: This device includes a lower surface plate 1 in which a polishing element for rough-polishing 4 is stuck and a wafer is placed and restrained, a first upper surface plate 12 in which a polishing device for rough-polishing 18 is stuck, a second upper surface plate 13 in which the polishing device for finish polishing 19 is stuck, and an exchanging means 21 for exchanging the first upper surface plate 12 with the second upper surface plate 13 to the wafer placed and held on the lower surface plate 1. In both the processes of the double-surface rough-polishing and the single-surface finish polishing, the wafer is placed and restrained on the lower surface plate 1, and the first upper surface plate for double-surface rough-polishing 12 and the second upper surface plate 13 for the single-surface finish polishing are exchanged for the wafer. <P>COPYRIGHT: (C)2003,JPO |
