| 摘要 |
The present invention discloses a structure of package socket and package legs for three-primary-color LED and the manufacturing method of this structure. One of the leg forms a die bonding seat and a common negative bonding pad, the other three legs form positive bonding pads. Said negative and positive bonding pads are arranged in the four corners of a square, with two legs stretch to the right, the other two legs stretch to the left. Then punch by a punch machine with a tooling to form an array of the structures, or by electrode plating or by etching to form the array. The four legs are then bending 90° to one side near the bonding pads such that it can stand alone. After die bond and wire bond has performed, the LED is sealed by transparent epoxy molding, and then cut to single structures, or the structure is cut to single structures before the LED is sealed by transparent epoxy. The other structure is by further bending the four legs near the end of the legs to satisfy surface mount technology (SMT).
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