| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder paste printing method enabling accurate solder printing with one solder mask. SOLUTION: The solder paste printing method comprises a process of preparing an array board 200 wherein circuit boards (1-16) each having a component mounting land 50 are arranged in the shape of a matrix and a process wherein, by using the solder mask 1000 having openings 20 for printing corresponding to one printing cell formed of one divided region obtained by dividing a region of the array board 200 wherein the circuit boards (1-16) are arranged in the shape of the matrix, by two or more integers (N), so that each region has the same shape as the others after the division, the solder paste printing is executed in times of the two or more integers (N), while position alignment as to at least one of the X-axis, the Y-axis and an angle of rotation within the XY-plane is conducted for each time of printing. COPYRIGHT: (C)2003,JPO
|
