| 摘要 |
The present invention relates to a guide-through assembly ( 4 ) for a filling level sensor working according to the principle of delay measurement of guided electromagnetic waves or for a capacitive filling level sensor, which for sealing the interior of the vessel against the interior of the sensor has no elastomeric sealing materials and in particular no elastomeric o-rings seals. This can be ensured by precisely machining the components which are essentially concentrically arranged in the guide-through assembly ( 4 ) on their circumferential surfaces ( 10, 11 ), so that in an assembled state the components arranged in the guide-through assembly ( 4 ), such as the interior conductor ( 7 ) and the dielectric materials ( 9, 12, 14 ) surrounding the interior conductor ( 7 ), contact each other at their mutually adjacent circumferential surfaces ( 11 ) in a sealing and positive engagement, so that additional sealing elements are not needed.
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