发明名称 |
Utilizing a convection cooled electronic circuit card for producing a conduction cooled electronic card module |
摘要 |
A conduction cooled electronic card module is designed for insertion into a chassis of an electronic device so as to transfer thereto a heat generated by electronic components of the module. The module comprises a circuit card of a convection cooled type, and a thermally conductive frame carrying the circuit card. The circuit card has a front surface carrying at least a part of the electronic components, and a rear surface at least edge areas of which are adapted to be in thermal contact with the chassis. The frame is in thermal contact with the part of the electronic components and with the front surface of the circuit card at least at edge areas thereof, so as to conduct heat generated by the electronic components, via the edge areas of the front surface to the edge areas of the rear surface of the circuit card.
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申请公布号 |
US6621706(B2) |
申请公布日期 |
2003.09.16 |
申请号 |
US20020145385 |
申请日期 |
2002.05.14 |
申请人 |
ELTA ELECTRONICS INDUSTRIES LTD. |
发明人 |
TZLIL JACOB;ZAGOORY RONEN |
分类号 |
H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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