METHOD FOR OBTAINING METAL TO METAL CONTACT BETWEEN A METAL SURFACE AND A BONDING PAD.

摘要

A method for obtaining metal-to-metal contact between a bonding surface of a metallic bonding area and a second metal surface is disclosed. The method comprises the steps of : - coating said bonding surface of said metallic bonding area with a chemical composition that forms a self-assembled monolayer on said bonding surface of said metallic bonding area, and - bonding said second metal surface on said coated bonding surface through said self­assembled monolayer. The combination of the coating step and the bonding step result in a metal to metal contact between the bonding surface of he metallic bonding area and the second metal surface. The metallic bonding area can be a semiconductor bond pad, e.g. of a semiconductor device.