发明名称 LAMINATED SHEET AND MOLDING USING THE SHEET
摘要 PROBLEM TO BE SOLVED: To provide a low-density laminated sheet for stamping molding excellent in heat resistance and high-temperature extensibility, and also to provide a molding using the laminated sheet. SOLUTION: An olefin resin sheet having such two or more melting endothermic peak temperatures by a differential thermal analysis that at least one of the two or more is 110 to 130°C, and the other is 140 to 170°C is laminated on at least one surface of an olefin resin crosslinked foam consisting of an olefin resin in which at least one of melting endothermic peak temperatures by the differential thermal analysis is 148°C or higher. The molding uses the thus laminated resin sheet. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003260766(A) 申请公布日期 2003.09.16
申请号 JP20020065713 申请日期 2002.03.11
申请人 SEKISUI CHEM CO LTD 发明人 TAKESHIMA KEISUKE
分类号 B32B27/32;B32B5/18;(IPC1-7):B32B27/32 主分类号 B32B27/32
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