| 摘要 |
A novel method of automatically controlling thickness of a metal film during film deposition in a deposition chamber. The method involves producing an X-ray beam directed to the metal film deposited on a wafer in a deposition chamber, and detecting X-ray fluorescence of the metal film. The thickness of the metal film determined based on the detected X-ray fluorescence is compared with a preset value to continue deposition if the determined thickness is less than the preset value. Deposition is stopped when the determined thickness reaches the preset value. |
