| 摘要 |
PURPOSE: An apparatus for taping a wafer is provided to perform a wafer aligning process and a wafer taping process at one place by using a center table and a taping table. CONSTITUTION: An apparatus for taping a wafer includes a wafer loading unit(210), the first wafer transfer unit(215), a center table(230), a taping table(235), the second wafer transfer unit(220), and a wafer unloading unit(225). The wafer loading unit(210) supplies sequentially wafers. The first wafer transfer unit(215) transfers the wafer. The center table(230) is used for aligning the wafer. The taping table(235) is divided into both sides of the center table(230). The second wafer transfer portion(220) transfers the wafer. The unloading portion unloads the wafer from the second wafer transfer portion(220).
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