发明名称 A resin mold coil
摘要 <p>In a wire before being wound as a coil, a thickness of a part of an electrically insulating layer on at least one of first and second body surface portions opposed to each other is larger than a thickness of a part of the electrically insulating layer on at least one of third and fourth body surface portions opposed to each other. An axial end of the coil is sealed by a silicone rubber of thermosetting type.</p>
申请公布号 IN191055(B) 申请公布日期 2003.09.13
申请号 IN1873CA1996 申请日期 1996.10.30
申请人 HITACHI LTD 发明人 NAKAYAMA AKIRA;SHIMIZU TOSHIO;TANEDA YUKINORI;IZUNA TOMOMI;KONDOU KAZUNARI;TSUTSUI HIROSHI;TSUJIGUCHI TAKAYUKI
分类号 H01B13/06;H01F5/00;H01F5/06;H01F27/28;H01F27/32;H01F41/04;H01F41/12;(IPC1-7):H01F5/06 主分类号 H01B13/06
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