| 摘要 |
PURPOSE: A sputtering target assembly and a sputtering apparatus using the same are provided to change the shape of a target without correcting/redesigning a backing plate when the target is eroded, to improve target utilization efficiency. CONSTITUTION: A sputtering target assembly(40) includes a backing plate(41) and a target(43,45). Both sides of the back plate are flat. One side of the target is flat and attached to one side of the backing plate. The other side of the target has a thickness varying with the position. A portion of the target where over erosion occurs is relatively thick. A sputtering apparatus includes the sputtering target assembly and a magnet. The magnet is located under the backing plate and forms a predetermined magnetic field in the target. |
