| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To stably generate plasma without thickening an electrostatic chuck 1, and at the same time to extremely reduce a temperature variation in a mount surface 3 in a wafer-mounting stage 20 where a base member 11 is joined to the electrostatic chuck 1 incorporated into a heater. <P>SOLUTION: The portion between the mount surface 3 of a flat body 2 for forming the electrostatic chuck 1 and a heater electrode 5 is formed of a dielectric layer 2a having a high thermal conductivity of 10 W/mK or more, and a dielectric layer 2b having a low thermal conductivity of 1 W/mK or less. <P>COPYRIGHT: (C)2003,JPO</p> |
