发明名称 DEVICE HOUSING FREE FROM ELECTROSTATIC HAZARD
摘要 PROBLEM TO BE SOLVED: To provide a device housing free from electrostatic hazard at a low cost in which and in device components of which no electrostatic hazard occurs. SOLUTION: The device housing is formed of a tourmaline alloy (3) which is made by mixing fine powder (2) of rough tourmaline into a metal primary material (1). When changes (4) of the surrounding environment of tourmaline such as heat generation, vibration or the like of a device (10) in the housing cause the electrolyzation of moisture (6) in the air by minus ions (5) constantly released by tourmaline and OH-ions (7) are generated. The OH-ions (7) and the moisture (6) in the air combine and change into hydroxyl ions (H3O2-) (8) as a surface-active substance. Since the monomolecular film of the hydroxyl ions is an insulator, the occurrence of electrostatic hazard to the device housing and device components in the housing can be prevented semipermanently and at a low cost by forming a monomolecular film (9) of hydroxyl ions as a surface-active substance and using it as an insulator on the surface of the tourmaline alloy or the surface of adjacent device components. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003258441(A) 申请公布日期 2003.09.12
申请号 JP20020109783 申请日期 2002.03.06
申请人 JUST KK;KATAGIRI SEISAKUSHO:KK;KURIMOTO KENCHIKU SEKKEI JIMUSHO:KK;KITA NIPPON DENSHI KK;ZAOU SEISAKUSHO:KK;REMON ENGINEERING:KK 发明人 OKAZAKI SHIGEO;KATAGIRI KYUKICHI;KURIMOTO TAKASHI;KIYONO ATSUSHI;TAKAHASHI MASARU;YAMAGUCHI KENICHI
分类号 H05K5/02;(IPC1-7):H05K5/02 主分类号 H05K5/02
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