| 摘要 |
PROBLEM TO BE SOLVED: To overcome a problem that an epoxy resin having big thermal conductivity of 0.3 W/m°C, which is filled into an thermoelectric device comprising a p-type thermoelectric semiconductor and an n-type thermoelectric semiconductor so as to enhance mechanical strength thereof, reduces thermoelectric performance of the thermoelectric device. SOLUTION: An insulator comprising a porous polyurethane resin, styrene resin or the like containing micro bubbles is filled between a p-type thermoelectric semiconductor and an n-type thermoelectric semiconductor that constitute a thermoelectric device, thus a thermoelectric device being provided that maintains mechanical strength equal to that of a thermoelectric device having an epoxy resin filled therein and also has thermoelectric performance equal to that of a thermoelectric device not having an epoxy resin filled therein. COPYRIGHT: (C)2003,JPO
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