| 摘要 |
PROBLEM TO BE SOLVED: To prevent deterioration of reliability of solder connection involved, as a result of a warpage resultant in a semiconductor package due to a thermal stress caused by the heating of semiconductor chips. SOLUTION: The semiconductor package, in which semiconductor chips are mounted on a carrier substrate, is equipped with the substrate of bimetallic structure of a combination of a low expansion substrate and a high expansion substrate, on a surface of a side opposite to a surface connected with the carrier substrate of the semiconductor chips. The substrate is positioned so that the side of the cubical thermal expansion substrate faces the surface of the semiconductor chips, thereby, warpages caused by the thermal stress of the semiconductor package, consisting of the semiconductors chips and carrier substrate, can be counteracted with each other, and then the reliability of solder connection of the semiconductor package can be enhanced. COPYRIGHT: (C)2003,JPO
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