| 发明名称 |
SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD |
| 摘要 |
PROBLEM TO BE SOLVED: To relax force applied to a pad film. SOLUTION: The pad film 4 is formed to cover a buffer film 3 formed locally on a layer insulation film 2 from above. COPYRIGHT: (C)2003,JPO
|
| 申请公布号 |
JP2003258019(A) |
申请公布日期 |
2003.09.12 |
| 申请号 |
JP20020062204 |
申请日期 |
2002.03.07 |
| 申请人 |
SEIKO EPSON CORP |
发明人 |
MACHIDA YOSHIHIKO |
| 分类号 |
H01L23/52;H01L21/3205;H01L21/60;(IPC1-7):H01L21/60;H01L21/320 |
主分类号 |
H01L23/52 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
