| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that, since size and shape of a photoresist in a plurality of patterns in a chip are measured and set values of exposure energy and focus correction values are decided by analyzing measured data in an exposure condition setting work performed for exposure treatment in the course of manufacturing semiconductor devices, types of semiconductor devices are changed quickly and the number of exposure condition setting works increases and, consequently, working efficiency of an exposure system falls and a semiconductor device manufacturing TAT increases when the semiconductor devices are manufactured in a small-scale many-kinds manufacturing mode. SOLUTION: At the time of performing an exposure condition setting experiment for the semiconductor device, the exposure condition for the semiconductor device is set from the size of a photoresist at one point in the chip, measured results, a reticle circuit pattern, specifications of the semiconductor device, and the preacquired information on the size and characteristics of the photoresist so that an error among the plurality of patterns in the chip may become the minimum. Thereafter, the exposure is performed by using the exposure condition. COPYRIGHT: (C)2003,JPO
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