| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor wafer supporting apparatus having a locking member for maintaining the locked state between a support rod and a support member over a long period even if a locking groove wall surface that is formed on the engagement surface of the locking member and the support rod is eroded by etching. <P>SOLUTION: The semiconductor wafer supporting apparatus comprises a plurality of support rods having a plurality of stages of wafer support sections and an engagement section at its end, a support member having a locking hole for engaging the plurality of support rods to the engagement section, and a locking member for locking so that the engagement section of the support rod is engaged to the locking hole of the support member. The locking member has a shaft 71 that is rotatably supported by the support member at its one end and has an engagement tongue 72 having an engagement surface in contact with the locking groove surface that is provided to the support rod at the other end. The engagement surface 721 of the engagement tongue is formed so that a length from a rotary center gradually increases from the downstream in a turning direction to the upstream in locking. <P>COPYRIGHT: (C)2003,JPO</p> |
