发明名称 METHOD OF MANUFACTURING MULTILAYERD CERAMIC SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To prevent the cracking of a baked substrate caused by a pressurizing force applied at the time of press-fixing an unbaked ceramic green sheet to the baked substrate in a method of manufacturing a multilayered ceramic substrate by which the multilayered ceramic substrate can be manufactured by baking the laminate of the baked substrate and an unbaked ceramic green sheet in a constrained state. SOLUTION: The unbaked ceramic green sheet 13 which is press-fixed to the baked substrate 12 is formed so that the thickness variation (the total thickness variation of a plurality of unbaked ceramic green sheets when the sheets are press-fixed to the substrate 12) of the sheet 13 at the time of press-fixing the sheet 13 to the substrate 12 becomes equal to or larger than a maximum thickness difference caused by recessed and projecting sections of the substrate 12. When the sheet 13 is formed in this way, the sheet 13 is flexibly deformed in accordance with the recessed and projecting sections of the surface 12 and the maximum thickness difference caused by the recessed and projecting sections of the substrate 12 can be absorbed by the thickness variation of the sheet 13 at the time of press-fixing the sheet 13 to the substrate 12. Consequently, a pressurizing force applied at the time of press-fixing the sheet 13 to the substrate 12 can be prevented from collectively acting on the protrusively warping part of the substrate 12. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003258424(A) 申请公布日期 2003.09.12
申请号 JP20020060034 申请日期 2002.03.06
申请人 SUMITOMO METAL ELECTRONICS DEVICES INC 发明人 ADACHI SATOSHI;FUKUDA JUNZO
分类号 H05K3/46;H01L23/12;(IPC1-7):H05K3/46 主分类号 H05K3/46
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