SUBMOUNT AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a submount whereto a semiconductor light emitting element can be fixed surely.

SOLUTION: A submount 3 is provided with a substrate 4 and a solder layer 8 formed on a main surface 4f of the substrate 4. Surface roughness Ra of the solder layer 8 before melting is 0.18 μm or less. Further preferably, the surface roughness Ra of the solder layer 8 is 0.10 μm or less. A semiconductor device 1 has a laser diode 2 mounted on the solder layer 8 of the submount 3.

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