| 摘要 |
PROBLEM TO BE SOLVED: To obtain a bonding tool in which bonding efficiency and bonding quality are improved by obtaining stable vibration characteristics and to obtain an apparatus for bonding. SOLUTION: The bonding tool for impressing an electronic component to a board by a load and vibration comprises an impressing part 30 used also as a bending vibration unit coupled to a horn 15 for vertically vibrating by a vibrator 17 for converting vertical vibration into bending vibration, and having a centerline CL2 crossed with a centerline CL1 of the horn 15 at a predetermined angleαin a range of 90 to 135°in plane parallel to the impressing direction. Thus, the vibrator 17 can be set separately from the board surface while the shape and the size of the bending vibration unit are suitably set, a thermal influence to the vibrator from the heated board is rejected, and the bonding tool having the stable vibration characteristics is obtained. COPYRIGHT: (C)2003,JPO
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