| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a package for receiving a semiconductor element, which is capable of normally and stably operating the semiconductor element, received therein over a long period of time, by completing airtight sealing of a vessel consisting of an insulation base plate and a lid body, even if the height of a metallic frame body is lowered. <P>SOLUTION: The package for receiving a semiconductor element is provided with an insulation base body 1, having a recessed part 1a for receiving the semiconductor element 3 on the upper surface of the same and a frame type metallized layer 7, formed so as to surround the recessed part 1a, and the metallic frame body 8 brazed to the metallized layer 7. The sectional configuration of the metallic frame body 8 is formed to have a substantially U-shape, in which flange units 8b, 8c are formed so as to extend outward at the upper and lower ends of the sidewall 8a of the frame body 8, while the thickness of the lower flange unit 8b is formed so as to be thinner than that of the upper flange unit 8c. <P>COPYRIGHT: (C)2003,JPO</p> |
