发明名称 DEVICE AND METHOD FOR REMOVING APPLIED FILM
摘要 PROBLEM TO BE SOLVED: To provide a device and a method for removing coated film by which the removing cost of applied films can be reduced by reducing the amount to be used of a liquid chemical and, in addition, the applied film formed on a peripheral edge section of a substrate can be removed in a shorter time for processing by increasing a coated film dissolving power of the liquid chemical. SOLUTION: The device for removing applied film is provided with a driving/ holding means 70 which rotates and inclines a substrate W having the coated film on its surface by holding the substrate W, and a liquid chemical storing means 25 which is provided in the vicinity of the means 70 and has an opening 25a to which part of the peripheral edge of the substrate W is faced when the substrate W is in an inclined and rotated state. In the storing means 25, the liquid chemical A used for dissolving the peripheral edge of the coated film is stored. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003257840(A) 申请公布日期 2003.09.12
申请号 JP20020060225 申请日期 2002.03.06
申请人 TOKYO ELECTRON LTD 发明人 NAGASHIMA SHINJI
分类号 G03F7/38;B05C9/12;B05C11/08;B05D1/40;H01L21/027;(IPC1-7):H01L21/027 主分类号 G03F7/38
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