| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board for forming a hybrid integrated circuit and a method for manufacturing the same, which can prevent solder from attaching to wire bonding electrodes, after performing solder mounting. SOLUTION: The circuit board consists of an insulating substrate 1, a first electrode 5 for solder mounting of an electronic component 17 on a surface 3 of the insulating substrate 1, and a second electrode 7 for establishing electrical connection to a bare chip 19 or a connector through wire bonding. A peelable organic resin 9 is coated on the surface of the second electrode 7. COPYRIGHT: (C)2003,JPO
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