| 摘要 |
PROBLEM TO BE SOLVED: To simplify further a manufacturing process of a coil component, by suppressing Cu at terminal of a lead wire present in its electrode from diffusing to a cream solder, and by preventing disconnection of the lead wire, etc. SOLUTION: The electrode 24 is so configured that an underlaying metal layer 26, a Cu layer 27, and a solder plating layer 28 are provided successively outward from above the elementary body of the coil component. The material of the solder plating layer 28 is formed as Sn containing no lead. A coil 23 is subjected to a thermo-compression bonding to the solder plating layer 28 from the outside of the layer 28. The coil 23 is also subjected to a thermo- compression bonding to the Cu layer 27. Therefore, the electrode 24 is connected with a land 30 of a mounting board 29 via a cream solder 31. COPYRIGHT: (C)2003,JPO
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