| 摘要 |
PROBLEM TO BE SOLVED: To provide a primary package in which variation in the shape of sealing resin can be reduced. SOLUTION: The primary package comprises an electronic element 1, conductive connecting bodies 2a-2g arranged on the electronic element 1, a substrate 3 connected electrically with the electronic element 1 through the conductive connecting bodies 2a-2g, a first resin layer 4 arranged on the substrate 3 to cover the electronic element 1, and a second resin layer 5 arranged on the first resin layer 4 and having a Young's modulus (E) higher than that of the first resin layer 4. COPYRIGHT: (C)2003,JPO
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