METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To increase the number of semiconductor chips obtained from one semiconductor wafer when the chip of a slender square shape in plane is fabricated. SOLUTION: A method for manufacturing a semiconductor device comprises steps of designing the width of a scribing region SCT extended in a direction parallel to the extending direction of the short side of a semiconductor chip forming region 1A in a degree in which the number of the chips obtained from one semiconductor wafer 1 is not decreased as much as possible; and designing the width of a scribing region SCY extended in a direction parallel to the extending direction of the long side of the semiconductor chip forming region 1A in a degree in which the region 1A is not cut at cutting the wafer 1 into individual chips. COPYRIGHT: (C)2003,JPO