发明名称 SEMICONDUCTOR ELEMENT AND METHOD FOR MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor element in which device characteristics can be improved by unifying a cooling rate of a semiconductor element melted by laser irradiation, and unifying/increasing grain sizes of growing crystals, and to provide a method for producing the element. SOLUTION: A semiconductor element 1, in which a base film 3 and a silicon film 4 are stacked in this order on a transparent substrate 2, is characterized in that the base film 3 has a higher thermal conductivity than that of the semiconductor film 4, and the semiconductor film 4 is a layer of semiconductor that is melted by irradiating the semiconductor element 1 with laser and then crystallized. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003257860(A) 申请公布日期 2003.09.12
申请号 JP20020262137 申请日期 2002.09.06
申请人 SHARP CORP 发明人 NAKAYAMA JUNICHIRO;OKAZAKI SHINYA
分类号 H01L21/20;H01L21/268;H01L21/336;H01L29/786;(IPC1-7):H01L21/20 主分类号 H01L21/20
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