发明名称 METHOD AND APPARATUS FOR ENCAPSULATION OF AN EDGE OF A SUBSTRATE DURING AN ELECTRO-CHEMICAL DEPOSITION PROCESS
摘要 An Electro-chemical deposition method and apparatus that encapsulates a substrate's edge to prevent deposition thereon is generally provided. In one embodiment, the apparatus includes a contact ring, one or more electrical contact pads disposed on the contact ring and a thrust plate axially movable relative to the contact ring. A first seal is disposed inward of the contact pad and seals with the contact ring. A second seal is coupled to the thrust plate. The first and second seals are adapted to sandwich the substrate therebetween when the contact ring and the thrust plate are moved towards each other. In another embodiment, a third seal provides a seal between the thrust plate and contact ring, and, with the first and second seals, defines an exclusion zone encapsulating the substrate's edge. One or more electrical contact pads are protected from the electrolyte by being disposed within the exclusion zone.
申请公布号 WO03006718(B1) 申请公布日期 2003.09.12
申请号 WO2002US21432 申请日期 2002.07.08
申请人 APPLIED MATERIALS, INC. 发明人 KHOLODENKO, ARNOLD, V.
分类号 C25D7/12;C25D17/06;H01L21/00;(IPC1-7):C25D17/06 主分类号 C25D7/12
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