| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for wire bonding in which the sealability of a connecting point is favorable by preventing a foreign matter such as a squeeze-out or the like generated at a connecting time using an ultrasonic vibration method from occurring and being scattered. <P>SOLUTION: The method for wire bonding comprises a first step of pressing a metal wire 2 on the surface of an electrode pad 5 by bringing a capillary 1 for bonding into contact with the connecting surface of a bonding position by predetermined pressure and vibrating the capillary 1 in a predetermined amplitude; and a second step of pressing the wire 2 on the electrode pad 5 by different pressure from that of the first step by vibrating the capillary 1 in a different amplitude from that of the first step so that in the second step, the pressure applied to the pad 5 is set larger than the pressure of the first step and the vibrating amplitude is smaller than that of the first step. <P>COPYRIGHT: (C)2003,JPO |
