发明名称 DISPLAY DEVICE AND MANUFACTURING METHOD THEREFOR
摘要 <P>PROBLEM TO BE SOLVED: To change an application start point so that a sealing resin does not flow out onto an EL element even if the sealing resin is crushed and spreads when bonding a device substrate and a sealing substrate mutually through the seal resin. <P>SOLUTION: In a manufacturing method for a display device according to this invention, the device substrate 200 and the sealing substrate 300 are mutually bonded through the sealing resin 400. When applying the seal resin along a peripheral part of the device substrate 200 and the sealing substrate 300, application of the sealing resin 400 applied along the peripheral part of the device substrate 200 and the sealing substrate 300 is started using a corner part of the substrate as an application start point 401, and an application end point is the same corner part as the application start point 401. <P>COPYRIGHT: (C)2003,JPO
申请公布号 JP2003257626(A) 申请公布日期 2003.09.12
申请号 JP20020057009 申请日期 2002.03.04
申请人 SANYO ELECTRIC CO LTD 发明人 KOMURA TETSUJI;SASAYA TORU
分类号 H01L27/32;H01L51/50;H01L51/52;H05B33/04;H05B33/10 主分类号 H01L27/32
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