| 发明名称 |
MOUNTING METHOD OF SEMICONDUCTOR ELEMENT WITH BUMP |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for mounting a semiconductor element with a bump without the initial deformation of a thin-film circuit board itself and the deformation of the thin-film circuit board due to heating in melting a bump in a mounting method for mounting and heating a semiconductor element with a bump on the thin-film circuit board. <P>SOLUTION: A semiconductor element with a bump can be mounted on a thin-film circuit board by restraining the initial deformation of a thin-film circuit board and deformation due to heating while sucking and fixing or by sucking and fixing the outer circumference to a fixing part of a flip chip mounting device from a bump of a semiconductor element with a bump mounted on the thin film circuit board. <P>COPYRIGHT: (C)2003,JPO</p> |
| 申请公布号 |
JP2003258028(A) |
申请公布日期 |
2003.09.12 |
| 申请号 |
JP20020052671 |
申请日期 |
2002.02.28 |
| 申请人 |
MIYOTA KK |
发明人 |
OI YOSHIAKI;TADAMA YOICHI |
| 分类号 |
H01L21/60;(IPC1-7):H01L21/60 |
主分类号 |
H01L21/60 |
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