| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a conductive paste that can secure electrical bonding and bonding strength between the electrode and the substrate. <P>SOLUTION: This is a conductive paste that contains silver powder, glass frit, and an organic vehicle and forms an electrode on a substrate having roughness. The above silver powder has a BET diameter larger than 0.10μm and 0.50μm or less and the average particle size (D<SB>50</SB>) larger than 0.2μm and less than 2.0μm and an average particle size (D<SB>50</SB>)/BET diameter of 10 or less. <P>COPYRIGHT: (C)2003,JPO</p> |
