| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To make the package size of a semiconductor device small. <P>SOLUTION: The rear electrode of a pellet 2, where a diode element is disposed inside, a bump electrode 4 which is electrically connected to the anode side of the diode element is arranged on the main face and the rear electrode, which is electrically connected to the cathode side of the diode element is formed on a rear face, is bonded to the recessed part of a frame 1 whose cross section is made into an uneven shape. The pallet 2 and the frame 1 are sealed by a sealing material 3 and the frame 1 and the sealing material 3 are cut along a cutting region. Thus, the semiconductor device is manufactured. <P>COPYRIGHT: (C)2003,JPO</p> |
