| 摘要 |
PROBLEM TO BE SOLVED: To cut a wiring substrate at an accurate position by recognizing a positioning mark. SOLUTION: The method of manufacturing a tape type wiring substrate includes cutting of the substrate 10 supporting a plurality of wiring patterns 22 arranged in the shape of matrix between the wiring patterns 22 at least allocated adjacently. On the substrate 10, a plurality of positioning marks 40 arranged on a line between adjacent wiring patterns 22 and the cutting process is performed with reference to the positioning mark 40. COPYRIGHT: (C)2003,JPO |
