发明名称 CIRCUIT BOARD MANUFACTURING BASE MATERIAL TREATMENT DEVICE AND BASE MATERIAL SAG DETECTING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a base material treatment device and a base material sag detecting method, which are capable of easily detecting whether a sheet base material of long length sags or not when the sheet base material is subjected to chemical treatment while it is transferred by a plurality of transfer rolls whose rotational speed controls interlock with each other. SOLUTION: A length detecting means for detecting the length of the sheet base material that passes through free rolls within a prescribed time is annexed to the free rolls. A length difference is obtained by subtracting the length of the sheet base material which passes through the lower free rolls within the same prescribed time at the same time, and detected by a length detecting means from the length of the sheet base material which passes through the upper free rolls within the same prescribed time at the same time and detected by the length detecting means. When the difference exceeds a prescribed length, the circuit board manufacturing base material treatment device issues signals informing that the sheet base material sags. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003258407(A) 申请公布日期 2003.09.12
申请号 JP20020342956 申请日期 2002.11.26
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 ISHIGURO HIROYUKI;SATO KOJI
分类号 H05K3/06;H01L23/12;H05K3/00;(IPC1-7):H05K3/00 主分类号 H05K3/06
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